Mobile terminal, earphone socket and method for manufacturing earphone socket

ABSTRACT

The present disclosure provides a mobile terminal, an earphone socket and a method for manufacturing an earphone socket. The earphone socket includes: a housing defining a mounting cavity; a support bracket in the mounting cavity; and a plurality of pins are located between the support bracket and inner walls of the mounting cavity, and the plurality of pins passes through a back wall of the mounting cavity to expose outer ends of the plurality of pins.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and benefits of Chinese PatentApplication No. 201610893613.1, filed with State Intellectual PropertyOffice on Oct. 13, 2016, and Chinese Patent Application No.201621119904.7, filed with State Intellectual Property Office on Oct.13, 2016, the entire content of which is incorporated herein byreference.

FIELD

The present disclosure relates to a technical field of mobile terminals,and particularly, to a mobile terminal, an earphone socket and a methodfor manufacturing an earphone socket.

BACKGROUND

In the related art, an earphone socket is used as a main adapter forelectrical signal transmission in all types of electronic products,specially provided as an audio connector for audio signal output/inputand more widely applied in various kinds of audiovisual products. Inparticular, with the rapid development of a variety of portableelectronic products, such as mobile phones, personal digital assistants(PAD), MP3 players, recording pens, and notebook computers, earphoneswith various sizes have been extensively used in those products inrecent years.

SUMMARY

The present disclosure provides an earphone socket. The earphone socketaccording to embodiments of present disclosure includes: a housing,defining a mounting cavity; a support bracket in the mounting cavity;and a plurality of pins, located between the support bracket and innerwalls of the mounting cavity, in which the plurality of pins passesthrough a back wall of the mounting cavity to expose outer ends of theplurality of pins.

The present disclosure further provides a mobile terminal. The mobileterminal according to embodiments of the present disclosure includes anearphone socket, and the earphone socket includes: a housing defining amounting cavity; a support bracket fixedly arranged in the mountingcavity; and a plurality of pins comprising at least one first pin, theat least one first pin being snapped onto the support bracket, and tailportions of the plurality of pins extending out of the mounting cavity.

The present disclosure further provides a method for manufacturing anearphone socket. With the earphone socket configured as the aboveearphone socket, the method according to embodiments of the presentdisclosure includes the following actions of: providing a housing, asupporting bracket and a plurality of pins; snapping the first pin ofthe plurality of pins onto the support bracket to constitute a supportbracket assembly; and inserting the support bracket assembly into themounting cavity of the housing from an end of the mounting cavity.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an earphone socket according to anembodiment of the present disclosure.

FIG. 2 is a rear view of an earphone socket according to an embodimentof the present disclosure.

FIG. 3 is a rear view of an earphone socket according to an embodimentof the present disclosure.

FIG. 4 is a sectional view of an earphone socket according to anembodiment of the present disclosure.

FIG. 5 is a perspective view of a housing of an earphone socketaccording to an embodiment of the present disclosure.

FIG. 6 is a sectional view of a housing of an earphone socket accordingto an embodiment of the present disclosure.

FIG. 7 is a sectional view of an earphone socket according to anembodiment of the present disclosure.

FIG. 8 is a schematic view of a support bracket and a pin of an earphonesocket according to an embodiment of the present disclosure.

FIG. 9 is a schematic view of a support bracket and a pin of an earphonesocket according to an embodiment of the present disclosure.

FIG. 10 is a sectional view of an earphone socket according to anembodiment of the present disclosure.

FIG. 11 is a schematic view of a mobile terminal according to anembodiment of the present disclosure.

DETAILED DESCRIPTION

Reference will be made in detail to embodiments of the presentdisclosure. Examples of the embodiments are illustrated in the drawings.The embodiments described herein with reference to drawings areexplanatory, and used to interpret the present disclosure. Theembodiments shall not be construed to limit the present disclosure.

In the specification, it is to be understood that terms such as“central,” “length,” “width,” “thickness,” “upper,” “lower,” “front,”“rear,” “left,” “right,” “inner,” “outer,” “axial” and “circumferential”should be construed to refer to the orientations or positions asdescribed or as illustrated in the drawings under discussion. Theserelative terms are for convenience of description and do not indicate orimply that the device or element referred to must have a particularorientation or be constructed or operated in a particular orientation.Thus, the relative terms shall not be construed to limit the presentdisclosure.

In addition, terms such as “first” and “second” are used herein forpurposes of description and are not intended to indicate or implyrelative importance or significance or to imply the number of indicatedtechnical features. Thus, the feature defined with “first” and “second”can comprise one or more of this feature. In the description of thepresent disclosure, “a plurality of” means two or more than two, unlessspecified otherwise.

In the present disclosure, unless specified or limited otherwise, theterms “mounted”, “connected”, “coupled”, “fixed” and the like are usedbroadly, and can be, for example, fixed connections, detachableconnections, or integral connections; can also be mechanical orelectrical connections; can also be direct connections or indirectconnections via intervening structures; can also be inner communicationsof two elements, which can be understood by those skilled in the artaccording to specific situations.

In the following, an earphone socket 100 according to embodiments of thepresent disclosure will be described with reference to FIGS. 1 to 11.

FIGS. 1 to 11 illustrate the earphone socket 100 according toembodiments of the present disclosure, and the earphone socket 100includes a housing 1, a supporting rack 2 and a plurality of pins 3.

Specifically, the housing 1 defines a mounting cavity 12, a rear end ofthe mounting cavity 12 is open, and a support bracket 2 is fixedlyarranged in the mounting cavity 12. The plurality of pins 3 are locatedbetween the support bracket 2 and inner walls of the mounting cavity 12,and the plurality of pins 3 passes through a back wall of the mountingcavity 12 to expose outer ends of the plurality of pins 3. The pluralityof pins 3 include at least one first pin 31, the at least one first pin31 is snapped onto the support bracket 2, and respective tail portionsof the plurality of pins 3 extend out of the mounting cavity 12 throughthe rear end of the mounting cavity 12. When assembled, a plurality offirst pins 31 can be first snapped onto the support bracket 2, and thenthe at least one first pin 31 and the support bracket 2 are assembledinto the mounting cavity 12 together from the rear end of the mountingcavity 12. Thus, it is unnecessary to assemble the at least one firstpin 31 individually, which can simplify a structure and an assemblingprocess of the earphone socket 100, save assembling time and improveproduction efficiency. Furthermore, the support bracket 2 can play arole of fixing and supporting the plurality of first pins 31, and hencewhen the earphone plug 200 is inserted into an insertion hole 11 in themounting cavity 12, reliability of connection between the first pin 31and the earphone plug 200 can be enhanced.

For the earphone socket 100 according to embodiments of the presentdisclosure, by providing the support bracket 2 in the mounting cavity12, and snapping the plurality of first pins 31 onto the support bracket2, it is possible to simplify the structure and the assembling processof the earphone socket 100, save the assembling time and improve theproduction efficiency. Meanwhile, the support bracket 2 can play therole of fixing and supporting the plurality of first pins 31, and hencewhen the earphone plug 200 is inserted into the insertion hole 11 in themounting cavity 12, the reliability of connection between the first pin31 and the earphone plug 200 can be enhanced.

In some embodiments of the present disclosure, as illustrated in FIGS.4, 8 and 10, the support bracket 2 is provided with a first supportingpassage 21, and the at least first pin 31 is snapped into the firstsupporting passage 21. The first supporting passage 21 can act asfixation and support for the at least one first pin 31, therebyenhancing the reliability of connection between the first pin 31 and theearphone plug 200.

As illustrated in FIG. 8, the earphone socket 100 has five pins 3,including three first pins 31. The three first pins 31 are located inthe middle of the five pins 3, one first pin 31 is located at a leftside of the insertion hole 11, and two first pins 31 are located at aright side of the insertion hole 11. The first pin 31 at the left sideof the insertion hole 11 has a same shape as the first pin 31 at theright side of the insertion hole 11 and adjacent to the insertion hole11, and these two first pins 31 each are provided with a flexed portion311 flexed rearwards at a head portion. The flexed portion 311 isprovided with a protruding portion 312 protruding towards an interior ofthe insertion hole 11, and the protruding portion 312 can be in contactwith the earphone plug 200 to realize connection with the earphone plug200. The first pin 31 at the right side of the insertion hole 11 andaway from the insertion hole 11 is provided with a bent portion 321 bentleftwards at the tail portion. A free end of the bent portion 321 isbent rearwards again to form a connecting segment 33, and the connectingsegment 33 extends out of the mounting cavity 12 through the rear end ofthe mounting cavity 12.

Further, one of the first supporting passage 21 and the first pin 31 isprovided with a first limiting protrusion 211, and the other of thefirst supporting passage 21 and the first pin 31 is provided with afirst limiting groove 313 fitted with the first limiting protrusion 211.Thus, the first pin 31 can be further fixed in the first supportingpassage 21 to prevent the first pin 31 from moving in the firstsupporting passage 21, so as to further guarantee the reliability ofconnection between the first pin 31 and the earphone plug 200.

As illustrated in FIG. 10, a first limiting groove 313 is defined in aside, away from the insertion hole 11, of the protruding portion 312 ofeach of the first pin 31 at the left side of the insertion hole 11 andthe first pin 31 at the right side of the insertion hole 11 and adjacentto the insertion hole 11, so as to accommodate a first limitingprotrusion 211 fitted with the first limiting groove 313 and provided ina first supporting passage for each of the two first pins 31. In such acase, a cross section of the first limiting groove 313 and a crosssection of the first limiting protrusion 211 are substantially shaped tobe triangular. A first limiting groove 313 is defined in the first pin31 at the right side of the insertion hole 11 and away from theinsertion hole 11, and the first limiting groove 313 is configured as anotch in the first pin 31 to accommodate a first limiting protrusion 211fitted with the first limiting groove 313 and provided in a firstsupporting passage for this first pins 31. In such a case, a crosssection of the first limiting groove 313 and a cross section of thefirst limiting protrusion 211 are substantially shaped to berectangular.

In some embodiments, as illustrated in FIG. 10, the support bracket 2and an inner sidewall of the mounting cavity 12 define a secondsupporting passage 22, the plurality of pins 3 include at least onesecond pin 32, and the at least one second pin 32 is snapped into thesecond supporting passage 22. The second supporting passage 22 can fixand support the at least one second pin 32, so as to enhance reliabilityof connection between the at least one second pin 32 and the earphoneplug 200. In addition, since the second supporting passage 22 is definedby the support bracket 2 and the inner sidewall of the mounting cavity12, it is possible to avoid providing the second supporting passage 22in the support bracket 2, which simplifies the structure of the supportbracket 2, and reduces a width of the support bracket 2 in a left-rightdirection, thereby decreasing a width of the earphone socket 100 in theleft and right direction and reducing a volume of the earphone socket100.

Further, one of the second supporting passage 22 and the second pin 32is provided with a second limiting protrusion 221, and the other thereofis provided with a second limiting groove 322 fitted with the secondlimiting protrusion 221. Thus, the at least one second pin 32 can befurther fixed in the second supporting passage 22 to prevent the secondpin 32 from moving in the second supporting passage 22, so as to furtherguarantee the reliability of connection between the at least one secondpin 32 and the earphone plug 200.

As illustrated in FIGS. 4, 9 and 10, a left sidewall and a rightsidewall of the support bracket 2 and the inner sidewall of the mountingcavity 12 define two second supporting passages 22. The plurality ofpins 3 include two second pins 32, and the two second pins 32 arelocated in the two second supporting passages 22 respectively. Each oftwo sidewalls of the support bracket 2 is provided with one secondlimiting protrusion 221, and each of the two second pins 32 is providedwith one second limiting groove 322, the second limiting groove 322being fitted with the second limiting protrusion 221. In a directiontowards an exterior of the insertion hole 11, a front end face of thesecond limiting protrusion 221 is inclined rearwards, such that thesecond limiting groove 322 can be fitted with the second limitingprotrusion 221 conveniently. When assembled, the second pin 32 can befirst snapped onto the support bracket 2, and then the second pins 32and the support bracket 2 are assembled into the mounting cavity 12together.

In some embodiments of the present disclosure, as illustrated in FIGS.1, 2, 3, 5 and 7, the housing 1 includes a fixed baffle 13. The fixedbaffle 13 is located at a rear end of the housing 1 and provided withclearance notches 131. The tail portions of the pins 3 pass through theclearance notches 131. In order to prevent the pin 3 from looseningduring insertion and removal of the earphone plug 200, a rear end faceof the housing 1 is filled with a waterproof glue to fix the pins 3.Meanwhile, the waterproof glue can play a waterproof and dustproof role,so as to prevent liquid (e.g. water) in the insertion hole 11 fromflowing to a circuit board along the pin 3 through the insertion hole11, thereby guaranteeing operational reliability of the circuit board.

The fixed baffle 13 protrudes beyond the rear end face of the housing 1,and thus can prevent the waterproof glue from flowing to the circuitboard, thereby further guaranteeing the operational reliability of thecircuit board. In addition, since the fixed baffle 13 protrudes beyondthe rear end face of the housing 1, when connecting segments 33 of thepins 3 are connected with the circuit board, the connecting segments 33need to bypass a rear end face of the fixed baffle 13 to be connectedwith the circuit board. When the fixed baffle 13 is provided with theclearance notches 131, the connecting segments 33 pass through theclearance notches 131 to be connected with the circuit board, which canreduce a length of the pins 3 along a front-rear direction (e.g. afront-rear direction illustrated in FIG. 1), so as to further decreasethe volume of the earphone socket 100. Meanwhile, the clearance notches131 can position the pins 3.

Further, as illustrated in FIGS. 2, 3 and 5, an open end of eachclearance notch 131 is provided with a guide bevel 132. For instance, inexamples illustrated in FIGS. 2, 3 and 5, two sidewalls of the clearancenotch 131 each are provided with the guide bevel 132, and the guidebevel 132 is inclined towards a direction away from an interior of theclearance notch 131 in the front-rear direction. Thus, when the pins 3are mounted in the mounting cavity 12 from the rear end of the housing1, guide bevels 132 can guide the pins 3 to make the connecting segments33 snapped into the clearance notches 131 smoothly.

In some embodiments of the present disclosure, as illustrated in FIGS.2, 3, 4 and 10, the support bracket 2 includes a rear-end baffle 23, andthe plurality of pins 3 can extend out of the mounting cavity 12 afterpassing through the rear-end baffle 23. The rear-end baffle 23 canprevent the support bracket 2 from coming out rearwards. Meanwhile, theglue can be filled in an accommodating chamber defined by a rear endface of the rear-end baffle 23 and an inner sidewall of the housing 1together, so as to fix the pins 3 and play the waterproof and dustproofrole at the same time. An end portion of at least one end of therear-end baffle 23 is provided with a cutting recess 231. As illustratedin FIG. 3, end portions of left and right ends of the rear-end baffle 23are correspondingly provided with the cutting recesses 231 extendingalong an up-down direction. The glue can be filled in the cutting recess231 to reinforce the fixing of the pins 3 and the waterproof anddustproof function under the action of the glue.

In some embodiments of the present disclosure, the earphone socket 100further includes a shielding cover body. The shielding cover bodyshields the rear end of the mounting cavity 12. An adhesive layer isprovided between the support bracket 2 and the shielding cover body, andprovided between the housing 1 and the shielding cover body. Theshielding cover body can further reinforce a waterproof and dustproofeffect of the earphone socket 100 on the one hand, and protect the pins3 extending out of the mounting cavity 12 from being damaged on theother hand. Meanwhile, the adhesive layer can enhance the waterproof anddustproof effect of the earphone socket 100.

In some embodiments of the present disclosure, as illustrated in FIGS. 1and 4, the housing 1 is provided with the insertion hole 11 and themounting cavity 12 therein. The insertion hole 11 has an open port 111at one end. The mounting cavity 12 is in communication with theinsertion hole 11. The earphone plug 200 can be inserted into theinsertion hole 11 through the open port 111. The plurality of pins 3 arelocated in the mounting cavity 12, and the mounting cavity 12 is incommunication with the insertion hole 11, such that one end of each ofthe plurality of pins 3 is connected with the earphone plug 200. Thehead portion of one of the plurality of pins 3 (e.g. the second pin 32as illustrated) extends out of the insertion hole 11 through the openport 111. When one of the plurality of pins 3 extends out from of theinsertion hole 11 through the open port 111, this pin 3 is in contactconnection with the earphone plug 200 outside the insertion hole 11, soas to reduce a length of the housing 1 along the front-rear direction(the front-rear direction illustrated in FIG. 1), decrease the volume ofthe earphone socket 100, and hence reduce a space occupied by theearphone socket 100 inside a mobile terminal 1000, thereby facilitatingminiaturization of the mobile terminal 1000.

In some embodiments of the present disclosure, the earphone socket 100further includes the circuit board. The tail portions of the pluralityof pins 3 extend out from a common sidewall (e.g. an upper wall) of thehousing 1 to be taken as the connecting segments 33. The circuit boardis provided with a plurality of bonding pads, and the connectingsegments 33 are welded to the bonding pads. Therefore, it is convenientto connect the connecting segments 33 of the tail portions of theplurality of pins 3 with the same circuit board. When the tail portionsof the plurality of pins 3 extend out from different sides, thestructure of the pins 3 will become complex if the tail portions of theplurality of pins 3 need to be welded with the same circuit board.Certainly, the plurality of pins 3 can be welded with different circuitboards, but the structural complexity of the earphone socket 100 will beraised, the volume of the earphone socket 100 will be increased, and itis not conducive to installation of the earphone socket 100. Therefore,by configuring the tail portions of the plurality of pins 3 to extendout from the same sidewall of the housing 1, the tail portions of theplurality of pins 3 can be connected with the same circuit board, whichcan not only simplify the structure of the plurality of pins 3, but alsosimplify the structure of the earphone socket 100, thus reducing thevolume of the earphone socket 100. Furthermore, the installation of theearphone socket 100 can be facilitated, and the layout of components inthe mobile terminal 1000 can be optimized.

In some embodiments of the present disclosure, the circuit board definesa connecting hole. At least one of the plurality of connecting segments33 extends into the connecting hole, and the bonding pad is arranged atthe connecting hole to be welded with the connecting segment 33.Therefore, it is possible to enhance reliability of connection betweenthe connecting segment 33 and the circuit board and prevent theconnecting segment 33 from being detached from the bonding pad of thecircuit board.

Further, the bonding pad is arranged in the connecting hole. Thus, whenthe connecting segment 33 extends into the connecting hole, theconnecting segment 33 can be connected with the bonding padconveniently, thereby enhancing the reliability of connection betweenthe connecting segment 33 and the circuit board. Optionally, the bondingpad can be shaped into a ring and fitted over an opening of theconnecting hole. Therefore, when the connecting segment 33 extends intothe connecting hole, the connecting segment 33 can be connected with thebonding pad conveniently, thereby enhancing the reliability ofconnection between the connecting segment 33 and the circuit board.

In some embodiments of the present disclosure, at least one of theplurality of connecting segments 33 is attached to the circuit board.The plurality of bonding pads can be provided on a surface of thecircuit board, and at least one of the plurality of connecting segments33 can be attached to the circuit board by being welded with the bondingpad. Therefore, it is possible to enlarge a welding area between theconnecting segment 33 and the circuit board, enhance the reliability ofconnection between the connecting segment 33 and the circuit board, andfacilitate the welding between the connecting segment 33 and the circuitboard.

In some embodiments of the present disclosure, as illustrated in FIGS.1, 5 and 6, the earphone socket 100 further includes a sealing member 4.The sealing member 4 extends along a periphery of the open port 111 andis embedded in an outer surface of the housing 1. Thus, it is possibleto prevent water outside the mobile terminal 1000 from flowing into themobile terminal 1000 along the outer surface of the housing 1 of theearphone socket 100, and hence avoid damaging the circuit board or thelike inside the mobile terminal 1000.

Further, as illustrated in FIG. 7, the housing 1 includes an outerhole-side-wall 15 (an outer portion of a side wall of an insertion holereceiving an earphone plug, the outer portion meaning a portion close tothe outside along an axial direction of the insertion hole) and an innerhole-side-wall 14 (an inner portion of a side wall of the insertion holereceiving an earphone plug, the inner portion meaning a portion awayfrom the outside along an axial direction of the insertion hole)arranged along a central axis of the insertion hole 11. A wall thicknessof the inner hole-side-wall 14 is greater than a wall thickness of theouter hole-side-wall 15. The inner hole-side-wall 14 and the outerhole-side-wall 15 together define the insertion hole 11 with the openport 111 at one end, and the open port 111 is located in the outerhole-side-wall 15. At least part of the sealing member 4 extends to theinner hole-side-wall 14. Since the sealing member 4 is embedded in thehousing 1 through an embedding groove 16, at least part of the embeddinggroove 16 can be provided in the inner hole-side-wall 14 when at leastpart of the sealing member 4 extends to the inner hole-side-wall 14.Since the thickness of the inner hole-side-wall 14 is greater than thatof the outer hole-side-wall 15, at least part of the embedding groove 16can be provided in the inner hole-side-wall 14, which can enhance astructural strength of the housing 1, improve operational reliability ofthe housing 1, and improve waterproof and dustproof reliability of theearphone socket 100.

An earphone socket 100 according to a specific embodiment of the presentdisclosure will be described with reference to FIGS. 1 to 11. Thefollowing description is only illustrative and intended to interpret thepresent disclosure but shall not be construed to limit the presentdisclosure.

As illustrated in FIGS. 1 to 11, the earphone socket 100 according tothe embodiment of the present disclosure includes the housing 1, thesupport bracket 2 and five pins 3.

Specifically, the housing 1 defines the mounting cavity 12 and theinsertion hole 11. The insertion hole 11 is in communication with themounting cavity 12, the rear end of the mounting cavity 12 is open, anda front end of the insertion hole 11 is open to define the open port111. The support bracket 2 is arranged in the mounting cavity 12. Thefive pins 3 include three first pins 31 and two second pins 32, and thethree first pins 31 are located between the two second pins 32. Onefirst pin 31 is located at the left side of the insertion hole 11, andtwo first pins 31 are located at the right side of the insertion hole11. The first pin 31 at the left side of the insertion hole 11 has thesame shape as the first pin 31 at the right side of the insertion hole11 and adjacent to the insertion hole 11, and these two first pins 31each are provided with the flexed portion 311 flexed rearwards at thehead portion. The flexed portion 311 is provided with the protrudingportion 312 protruding towards the interior of the insertion hole 11,and the protruding portion 312 can be in contact with the earphone plug200 to realize the connection with the earphone plug 200. The first pin31 at the right side of the insertion hole 11 and away from theinsertion hole 11 is provided with the bent portion 321 bent leftwardsat the tail portion. The free end of the bent portion 321 is bentrearwards again to form the connecting segment 33, and the connectingsegment 33 extends out of the mounting cavity 12 through the rear end ofthe mounting cavity 12.

As illustrated in FIGS. 4 and 10, the support bracket 2 is provided withfirst supporting passages 21, and the first pins 31 are snapped into thefirst supporting passages 21. The first limiting groove 313 is definedin the side, away from the insertion hole 11, of the protruding portion312 of each of the first pin 31 at the left side of the insertion hole11 and the first pin 31 at the right side of the insertion hole 11 andadjacent to the insertion hole 11, so as to accommodate the firstlimiting protrusion 211 fitted with the first limiting groove 313 andprovided in the first supporting passage for each of the two first pins31. In such a case, the cross section of the first limiting groove 313and that of the first limiting protrusion 211 are substantially shapedto be triangular. The first limiting groove 313 is defined in the firstpin 31 at the right side of the insertion hole 11 and away from theinsertion hole 11, and the first limiting groove 313 is configured asthe notch in the first pin 31 to accommodate the first limitingprotrusion 211 fitted with the first limiting groove 313 and provided inthe first supporting passage for this first pins 31. In such a case, thecross section of the first limiting groove 313 and that of the firstlimiting protrusion 211 are substantially shaped to be rectangular.

As illustrated in FIGS. 4 and 10, a left side wall and a right side wallof the support bracket 2 and the inner sidewall of the mounting cavity12 define two second supporting passages 22, and two second pins 32 arelocated in the two second supporting passages 22 respectively. Each oftwo sidewalls of the support bracket 2 is provided with one secondlimiting protrusion 221, each of the two second pins 32 is provided withone second limiting groove 322, and the second limiting groove 322 isfitted with the second limiting protrusion 221. In the direction towardsthe exterior of the insertion hole 11, the front end face of the secondlimiting protrusion 221 is inclined rearwards, such that the secondlimiting groove 322 can be fitted with the second limiting protrusion221 conveniently. When assembled, the second pins 32 can be firstsnapped onto the support bracket 2, and then the second pins 32 and thesupport bracket 2 are assembled into the mounting cavity 12 together.

As illustrated in FIGS. 1, 2, 3 and 5, the housing 1 includes the fixedbaffle 13. The fixed baffle 13 is located at a rear end of the housing 1and provided with clearance notches 131. The tail portions of the pins 3passes through the clearance notches 131. In order to prevent the pins 3from loosening during the insertion and removal of the earphone plug200, the rear end face of the housing 1 is filled with the waterproofglue to fix the pins 3. Meanwhile, the waterproof glue can play thewaterproof and dustproof role, so as to prevent the liquid (e.g. water)in the insertion hole 11 from flowing to the circuit board along the pin3 through the insertion hole 11, thereby guaranteeing the operationalreliability of the circuit board.

The fixed baffle 13 protrudes beyond the rear end face of the housing 1,and thus can prevent the waterproof glue from flowing to the circuitboard, thereby further guaranteeing the operational reliability of thecircuit board. In addition, since the fixed baffle 13 protrudes beyondthe rear end face of the housing 1, when connecting segments 33 of thepin 3 are connected with the circuit board, the connecting segments 33need to bypass the rear end face of the fixed baffle 13 to be connectedwith the circuit board. When the fixed baffle 13 is provided with theclearance notches 131, the connecting segments 33 pass through theclearance notches 131 to be connected with the circuit board, which canreduce the length of the pins 3 along the front-rear direction (e.g. thefront-rear direction illustrated in FIG. 1), so as to further decreasethe volume of the earphone socket 100. Meanwhile, the clearance notch131 can position the pins 3.

Two sidewalls of each clearance notch 131 each are provided with theguide bevel 132, and the guide bevel 132 is inclined towards thedirection away from the interior of the clearance notch 131 in thefront-rear direction. Thus, when the pins 3 are mounted in the mountingcavity 12 from the rear end of the housing 1, the guide bevels 132 canguide the pins 3 to make the connecting segments 33 snapped into theclearance notches 131 smoothly.

As illustrated in FIGS. 2, 3, 4 and 10, the support bracket 2 includes arear-end baffle 23, and the plurality of pins 3 can extend out of themounting cavity 12 after passing through the rear-end baffle 23. Therear-end baffle 23 can prevent the support bracket 2 from coming outrearwards. Meanwhile, the glue can be filled in an accommodating chamberdefined by the rear end face of the rear-end baffle 23 and the innersidewall of the housing 1 together, so as to fix the pin 3 and play thewaterproof and dustproof role at the same time. The end portion of atleast one end of the rear-end baffle 23 is provided with the cuttingrecess 231. As illustrated in FIG. 3, end portions of left and rightends of the rear-end baffle 23 are separately provided with the cuttingrecess 231 extending along the up-down direction. The glue can be filledin the cutting recess 231 to reinforce the fixing the pins 3 and thewaterproof and dustproof function under the action of the glue.

The earphone socket 100 further includes the shielding cover body. Theshielding cover body shields the rear end of the mounting cavity 12. Theadhesive layer is provided between the support bracket 2 and theshielding cover body, and provided between the housing 1 and theshielding cover body. The shielding cover body can further reinforce thewaterproof and dustproof effect of the earphone socket 100 on the onehand, and protect the pins 3 extending out of the mounting cavity 12from being damaged on the other hand. Meanwhile, the adhesive layer canenhance the waterproof and dustproof effect of the earphone socket 100.

The mobile terminal 1000 according to embodiments of the presentdisclosure will be described with reference to FIGS. 1 to 11.

The mobile terminal 1000 according to embodiments of the presentdisclosure includes the above earphone socket 100. By providing theabove earphone socket 100, the tail portions of the plurality of pins 3can be connected with the same circuit board, which can not onlysimplify the structure of the plurality of pins 3, but also simplify thestructure of the earphone socket 100, thus reducing the volume of theearphone socket 100. Furthermore, the installation of the earphonesocket 100 can be facilitated, and the layout of components in themobile terminal 1000 can be optimized.

In some embodiments of the present disclosure, the mobile terminal 1000can be a mobile phone, a tablet computer, a notebook computer and so on.

In the following, a method for manufacturing an earphone socket 100according to embodiments of the present disclosure will be describedwith reference to FIGS. 1 to 11.

For the earphone socket 100 configured as the above earphone socket 100,the manufacturing method includes the following actions. A housing 1, asupporting bracket 2 and a plurality of pins 3 are provided. In S10, afirst pin 31 of the plurality of pins 3 is snapped onto the supportbracket 2 to constitute a support bracket assembly; and in S20, thesupport bracket assembly is inserted into the mounting cavity 12 of thehousing from the rear end of the mounting cavity 12.

With the method according to embodiments of the present disclosure, thestructure and the assembling process of the earphone socket 100 can besimplified, the assembling time can be saved, and the productionefficiency can be improved.

In some embodiments of the present disclosure, the second pin 32 canalso be snapped onto the support bracket 2 to constitute the supportbracket assembly, and then the support bracket assembly assembled withthe first pin 31 and the second pin 32 can be inserted into the mountingcavity 12 from the rear end of the mounting cavity 12.

In some embodiments of the present disclosure, the earphone socket 100further includes the shielding cover body, and the shielding cover bodyshields the rear end of the mounting cavity 12. The method furtherincludes an action S30 of providing a shielding cover body, providing anadhesive layer between the support bracket and the shielding cover body,and providing another adhesive layer between the housing and theshielding cover body. The shielding cover body can further reinforce thewaterproof and dustproof effect of the earphone socket 100 on the onehand, and protect the pins 3 extending out of the mounting cavity 12from being damaged on the other hand. Meanwhile, the adhesive layer canenhance the waterproof and dustproof effect of the earphone socket 100.

Reference throughout this specification to “an embodiment”, “someembodiments”, “an example”, “a specific example” or “some examples”means that a particular feature, structure, material, or characteristicdescribed in connection with the embodiment or example is included in atleast one embodiment or example of the present disclosure. Thus, theappearances of the above phrases throughout this specification are notnecessarily referring to the same embodiment or example of the presentdisclosure. Furthermore, the particular features, structures, materials,or characteristics can be combined in any suitable manner in one or moreembodiments or examples. Moreover, different embodiments or examples aswell as the features in the different embodiments or examples describedin the specification can be combined or united by those skilled in therelated art in the absence of contradictory circumstances.

Although embodiments of the present disclosure have been shown andillustrated, it shall be understood by those skilled in the art that theabove embodiments are explanatory and cannot be construed to limit thepresent disclosure, and changes, modifications, alternatives andvariants can be made in the embodiments without departing from the scopeof the present disclosure.

What is claimed is:
 1. An earphone socket, comprising: a housing,defining a mounting cavity; a support bracket in the mounting cavity;and a plurality of pins, located between the support bracket and innerwalls of the mounting cavity, wherein the plurality of pins passesthrough a back wall of the mounting cavity to expose outer ends of theplurality of pins; wherein the support bracket is provided with asupporting passage, and at least one pin is snapped into the supportingpassage.
 2. An earphone socket comprising: a housing, defining amounting cavity; a support bracket located in the mounting cavity andprovided with a first supporting passage, and at least one first pinbeing snapped into the first supporting passage; and a plurality ofpins, located between the support bracket and inner walls of themounting cavity, wherein the plurality of pins passes through a backwall of the mounting cavity to expose outer ends of the plurality ofpins, wherein one of the first supporting passage and the at least onefirst pin is provided with a first limiting protrusion, and the other ofthe first supporting passage and the at least one first pin is providedwith a first limiting groove fitted with the first limiting protrusion.3. The earphone socket according to claim 2, wherein the at least onefirst pin is provided with the first limiting groove, and the firstsupporting passage is provided with the first limiting protrusiontherein, the at least one first pin is provided with a flexed portionflexed to a side at a head portion, the flexed portion is provided witha protruding portion, and the first limiting groove is defined in a sideof the protruding portion.
 4. The earphone socket according to claim 3,wherein the first limiting groove and the first limiting protrusion bothhave a substantially triangular cross section.
 5. The earphone socketaccording to claim 2, wherein the at least one first pin is providedwith the first limiting groove, and the first supporting passage isprovided with the first limiting protrusion therein, and the firstlimiting groove is configured as a notch.
 6. The earphone socketaccording to claim 5, wherein the first limiting groove and the firstlimiting protrusion both have a substantially rectangular cross section.7. The earphone socket according to claim 5, wherein the at least onefirst pin is provided with a bent portion at a tail portion thereof, thebent portion has a free end extending to a side again to form aconnecting segment, and the connecting segment extends out of themounting cavity through a rear end of the mounting cavity.
 8. Theearphone socket according to claim 2, wherein the support bracket and aninner sidewall of the mounting cavity define a second supportingpassage, and the plurality of pins include at least one second pin, andthe at least one second pin is snapped into the second supportingpassage.
 9. The earphone socket according to claim 8, wherein one of thesecond supporting passage and the at least one second pin is providedwith a second limiting protrusion, and the other thereof is providedwith a second limiting groove fitted with the second limitingprotrusion.
 10. The earphone socket according to claim 9, wherein thesupport bracket has a sidewall of provided with the second limitingprotrusion, and the at least one second pin is provided with the secondlimiting groove, an end face of the second limiting protrusion isinclined to one side.
 11. The earphone socket according to claim 1,wherein the housing comprises a fixed baffle; the fixed baffle islocated at a rear end of the housing and provided with clearancenotches; and tail portions of the plurality of pins pass through theclearance notches.
 12. The earphone socket according to claim 11,wherein an open end of each clearance notch is provided with a guidebevel.
 13. An earphone socket, comprising: a housing, defining amounting cavity; a support bracket located in the mounting cavity andcomprising a rear-end baffle, the rear-end baffle having two endportions provided with the cutting recesses, and the cutting recessesbeing configured to be filled with glue; and a plurality of pins,located between the support bracket and inner walls of the mountingcavity, wherein the plurality of pins passes through a back wall of themounting cavity to expose outer ends of the plurality of pins.
 14. Theearphone socket according to claim 1, further comprising a circuitboard, the plurality of pins have tail portions extending out from acommon sidewall of the housing to be taken as connecting segments, thecircuit board is provided with a plurality of bonding pads, and theconnecting segments are welded to the bonding pads.
 15. The earphonesocket according to claim 1, further comprising a shielding cover bodyconfigured to shield a rear end of the mounting cavity, an adhesivelayer being provided between the support bracket and the shielding coverbody and between the housing and the shielding cover body separately.16. The earphone socket according to claim 2, wherein the housingcomprises a fixed baffle; the fixed baffle is located at a rear end ofthe housing and provided with clearance notches; and the tail portionsof the plurality of pins pass through the clearance notches.
 17. Theearphone socket according to claim 2, further comprising a circuitboard, the plurality of pins have tail portions extending out from acommon sidewall of the housing to be taken as connecting segments, thecircuit board is provided with a plurality of bonding pads, and theconnecting segments are welded to the bonding pads.
 18. The earphonesocket according to claim 2, further comprising a shielding cover bodyconfigured to shield the rear end of the mounting cavity, an adhesivelayer being provided between the support bracket and the shielding coverbody and between the housing and the shielding cover body separately.19. The earphone socket according to claim 13, wherein the housingcomprises a fixed baffle; the fixed baffle is located at a rear end ofthe housing and provided with clearance notches; and the tail portionsof the plurality of pins pass through the clearance notches.